TECThermo provides solutions for thermal testing utilizing Thermo Electric Couplers (TEC's) also known as peltier elements.

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"TecThermo provided quick and customized service in a very timely manner and at a competitive price. I continue to use their services and highly recommend them." - Eugene Chow, Xerox Parc, Palo Alto

Products:

The TECThermo bench top TEC Temperature Controlled Socket Test System offers a low cost means to conveniently stress test Integrated Circuit chips by heat cycling without the need for a large test chamber, air streams or liquid nitrogen.

The state of the art system cycles test chips through a range of pre-programmed or user specified heating and cooling steps and varying soak times for burn in characterization.

The test system uses quiet solid-state heating and cooling devices to achieve a practical test range of 0 degrees C to +85 degrees C. The temperature range can be extended with custom design.

The user can easily program test parameters using the menu driven TECThermo Test System Controller with its front panel mounted command switches and an LCD user interface display. An integral TEC device mounted to the lid of the test socket either heats or cools the test chip with maximum temperature excursions from ambient dependent on the beginning ambient temperature and the application and type of chip under test.
The system program prompts the TEC device to either heat or cool, as programmed, to the desired temperatures. Once a selected temperature is attained, the temperature is maintained for the prescribed length of time (the Soak Period) and then the program instructs the TEC device to advance to the next temperature step and soak period. Temperatures are sensed by a thermistor mounted on the bottom center of the TEC Assembly interface block.

Temperatures may be programmed by selecting any of four previously entered Ramp-Soak profiles consisting of up to eight steps each, plus one user specified Manual Set profile.

Tests:

  • Will terminate automatically at the conclusion of a selected Ramp-Soak profile by entering idle state where the TEC is turned off,

 

  • May be set to loop back to the beginning of that profile to automatically repeat the test, or

 

  • May be set to stay at the last temperature

Datasheets:

Software:

ThermoTEC Track software provides a means for computer logging of test data. Temperature and time data are logged into a comma delimited text file, which may be imported into a data processing application, such as Excel, for archiving, statistical analysis, charting and other manipulation by the user.

System Components:

The TECThermo TEC Temperature Controlled Socket Test System consists of the following component parts and subassembly:

  • Temperature Controller,
  • A nine conductor Controller-to-Test Socket Interconnect Cable,
  • The TEC Assembly.

    The TEC Assembly consists of:

    • A TEC thermoelectric device for heating and cooling,
    • A heat sink,
    • An auxiliary cooling fan,
    • A standard 35mm x 35mm adapter plate,
    • An interface block with built in temperature sensing thermistors

A customer supplied Test Socket and Socket Mount complete the Test System.

Available Options:

Optional custom adapter plates are available in other sizes, but may change the thermal characteristics of the TEC Assembly.

A test fixture is under development, which will allow testing of board-mounted chips.

Services:

  • The temperature range of the TEC can be extended with custom design.
  • The TEC can be modified to fit custom test sockets.

Customers:

  • Apple Computer (Calibration of final assembly G5)
  • Foxconn (Manufacturing Calibration)
  • Solectron (Manufacturing Calibration)
  • Boeing (Satellite Thermal Cycle testing)
  • nLight Photonics (Laser diodes)
  • Agilent (Laser diodes)
  • Xerox PARC (Laser diodes)
  • New York State University (Crytal Crowth Control)
  • Seelink Tech Inc.
  • DCI
  • Contech Solutions

Custom design solutions are available for your heating and cooling issues.

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